19
Aug
Proposed funding, coupled with an estimated $6 billion to $8 billion in investment tax credit, will help TI provide geopolitically dependable, 300mm capacity for analog and embedded processing semiconductors
NEWS HIGHLIGHTS:
The U.S. Department of Commerce has proposed up to $1.6 billion for TI in direct funding through the CHIPS and Science Act to support three 300mm semiconductor wafer fabs under construction in Texas and Utah.
TI expects to receive an estimated $6 billion to $8 billion from the U.S....